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EU-Förderung (24,9 Mio. €): Integration von Prozessen und MoDules für den 2 nm-Knoten, der die Anforderungen von Power Performance Area und Cost erfüllt Hor 21.05.2021 EU-Rahmenprogramm für Forschung und Innovation "Horizont"

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Integration von Prozessen und MoDules für den 2 nm-Knoten, der die Anforderungen von Power Performance Area und Cost erfüllt

In the ID2PPAC project the technology solutions for the 2nm node identified in the preceding project IT2 will be consolidated and integrated with the objective to demonstrate that Performance Power Area and Cost (PPAC) requirements for this generation of leading edge logic technology can be achieved. To continue the Moore’s law trajectory to the 2nm node, while meeting PPAC requirements, the combination of further advancements in EUV lithography & masks, 3D device structures, materials and metrology is required. The strength of the project pivots on the focused engagement of leading expert partners in these key interlocking areas and a shared pilot line. The ID2PPAC project, is expected to enable IC-fabs to do EUV-based, single-print, High Volume Manufacturing for the 2nm node by 2025. This technology evolution is driven by the growing demand for compute power which increases more than exponentially with time and has made the world migrate from 1 billion interconnected devices in the “PC era” to 10 billion in the “Mobile + cloud era” to the future “Intelligence era” in which there will be over 100 billion intelligent connected devices. To enable this growth, the semiconductor industry is continuously pursuing technology innovations to realize this progress as has been predicted by Moore’s Law and will continue to do so. The project will also help to expand Europe's technological capacity to act in this field, which is crucial for digitization, (edge) AI and for solving national, European and global societal challenges and will strengthen the consortium of leading European companies and institutes active in this sector.


Geförderte Unternehmen:

Firmenname Förderungssumme
Advanced Mask Technology Center GmbH & Co. KG 279.750 €
Applied Materials Israel Ltd. 553.750 €
Asml Netherlands B.V. 2.713.200 €
Cameca SAS 140.000 €
Carl Zeiss SMS Ltd. 972.740 €
Carl Zeiss SMT GmbH 4.094.071 €
Crytur Spol s.r.o. 244.210 €
EV Group E. Thallner GmbH 294.285 €
FEI Electron Optics B.V. 1.124.000 €
Fraunhofer Gesellschaft ZUR Forderung DER Angewandten Forschung e. V. 282.038 €
Fundacio Institut de Ciencies Fotoniques 66.325 €
Fyzikalni Ustav AV CR, VVI 65.538 €
Icos Vision Systems N.V. 368.750 €
Institut Fuer Mikroelektronik Stuttgart 890.498 €
Interuniversitair Micro-Electronica Centrum 5.092.325 €
JSR Micro N.V. 113.281 €
KLA-Tencor Corporation (Israel) 1.205.000 €
LAM Research International B.V. 734.375 €
LAM Research SAS 286.756 €
Mellanox Technologies Ltd. - MLNX 1.300.000 €
Nederlandse Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek TNO 651.951 €
Nova Ltd. 1.260.000 €
Optix FAB GmbH 171.875 €
Plansee SE 592.207 €
PVA Tepla Analytical Systems GmbH 600.000 €
Recif Technologies 326.986 €
VDL ETG Technology & Development B.V. 431.407 €

Quelle: https://cordis.europa.eu/project/id/101007254

Diese Bekanntmachung wurde von Englisch nach Deutsch übersetzt. Die Bekanntmachung bezieht sich auf einen vergangenen Zeitpunkt, und spiegelt nicht notwendigerweise den heutigen Stand wider.