Die Suchmaschine für Unternehmensdaten in Europa

EU-Förderung (28 Mio. €): 300mm Pilot line für Smart Power und Power Discretes Hor 22.05.2017 EU-Rahmenprogramm für Forschung und Innovation "Horizont"

Auf einen Blick

Text

300mm Pilot line für Smart Power und Power Discretes

R3-POWERUP will push through the new generation of 300mm Pilot Line Facility for Smart Power technology in Europe. This will enable the European industry to set the world reference of innovative and competitive solutions for critical societal challenges, like Energy saving and CO2 Reduction (ref. to COP21 Agreement ), as well as Sustainable Environment through electric mobility and industrial power efficiency. ● Development and demonstration of a brand new 300mm advanced manufacturing facility addressing a multi-KET Pilot Line (i.e. Nanoelectronics, Nanotechnology, Advanced Manufacturing) ● Improvement in productivity and competitiveness of integrated IC solutions for smart power and power discrete technologies. The strategy of the project is the following: ● The Pilot Line will enable the realization of sub-100nm Smart Power processes, starting from the 90nm BCD10 process, taking profit from the advanced and peculiar equipments available only for 300mm wafer size. ● The availability of a 300mm full processing line will also exploit the portability to 300mm of the most critical and expensive process steps devoted to power discrete devices. ● The Pilot Line will build on Digital Factory and Industry 4.0 principles, enforcing a flexible, adaptive and reliable facility, in order to investigate also the synergy and economic feasibility of supporting both Smart Power and power discrete processes in the same manufacturing line. ● The application of such technologies will be a breakthrough enabler for Energy Efficiency and CO2 Reduction worldwide, in line with COP21’s global action plan. The Pilot Line is based on three main pillars: 1. Market driven continuous innovation on smart-power and power discrete; 2. Industrial policy focused on high quality and mass production’s cost optimization; 3. Set the ground for future wafer upgrade of “More than Moore” disruptive technologies (e.g. advanced MEMS manufacturing, now at 200mm)


Geförderte Unternehmen:

Firmenname Förderungssumme
Advanced Packaging Center B.V. 170.000 €
Alma Mater Studiorum - Universita Di Bologna 0,00 €
AP&S International GmbH 93.750 €
Applied Materials France 23.911 €
Applied Materials Ireland Ltd. 54.791 €
Applied Materials Israel Ltd. 300.000 €
ASM Europe B.V. 52.950 €
Atotech Deutschland GmbH 40.000 €
Besi Austria GmbH 240.000 €
Consiglio Nazionale Delle Ricerche 122.500 €
Consorzio Nazionale Interuniversitario Per LA Nanoelettronica 385.000 €
Disco HI-TEC Europe GmbH 120.000 €
EV Group E. Thallner GmbH 92.803 €
Green Power Technologies SL 125.000 €
Icos Vision Systems N.V. 318.000 €
Institut Mikroelektronickych Aplikaci s.r.o. 74.531 €
KLA-Tencor MIE GmbH 276.250 €
LAM Research SAS 70.000 €
Laser Systems & Solutions OF Europe 59.733 €
Nano Design s.r.o. 42.500 €
Nova Ltd. 100.000 €
Nova Measuring Instruments GmbH 80.000 €
Picosun Oy 300.000 €
Politecnico Di Milano 0,00 €
Politecnico Di Torino 122.500 €
Robert Bosch GmbH 594.086 €
Siec Badawcza Lukasiewicz - Instytut Mikroelektroniki i Fotoniki 139.650 €
Siltronic AG 100.000 €
Slovenska Technicka Univerzita V Bratislave 98.000 €
Soitec SA 99.996 €
Stmicroelectronics Srl 23,2 Mio. €
Tritem sp. z o.o. 50.000 €
Universidad de Sevilla 106.164 €
Universita Degli Studi Di Padova 0,00 €
Universita Degli Studi Di Pavia 122.500 €
Universita Degli Studi Di Udine 0,00 €
Universita Di Pisa 122.500 €
Universitatea Politehnica Din Bucuresti 0,00 €
Vysoke Uceni Technicke V Brne 105.000 €

Quelle: https://cordis.europa.eu/project/id/737417

Diese Bekanntmachung wurde von Englisch nach Deutsch übersetzt. Die Bekanntmachung bezieht sich auf einen vergangenen Zeitpunkt, und spiegelt nicht notwendigerweise den heutigen Stand wider.